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Relevant Course Labs/Projects
Gear Box
This project involved designing the gears, pinions, shafts and key for a gearbox. Each component was created in CAD according to AGMA (American Gear Manufacturers Association) standards and was subjected to stress and strain simulations. A copy of the project is linked here: https://docs.google.com/presentation/d/1FmtgLS4zNJavaD5o2Fuysm8fMnIZiAGRFXYXpoW4fM4/edit?usp=sharing
API Petroleum Pipe Connector
This project will design an America Petroleum Industry (API) 5000 psi rated flange to connect a fully rigged tank to a piping system to a petroleum plant. Stress/strain analyses were conducted on the flange system and developed a safety factor for the structure. These simulations were performed to make sure the assembly could withstand the pressure of the petroleum without causing leaks. Components created and tested in the design included two sides of the flange, the gasket, and bolts securing the system. Here is a link to the projects report: https://docs.google.com/document/d/1_HkCbkfYb8w6A-mnsxeu_TGqCKFDaFMikVyMzDff5Rk/edit?usp=sharing
R Grading Statistics
For my Probability and Statistics for Engineers course, I created a program in R that calculated the mean, median, mode, variance, and standard deviation from a dataset of students' grades and the number of credits they are taking. This project demonstrated my understanding of statistics and competency coding in R. Link to project: https://docs.google.com/document/d/13aaAD4EdsctADNIu3dFqvjg3f64OlMNq6U0PvPaPycU/edit?usp=sharing
Apartment Room Heat Transfer
This project was to analyze the heat transfer rate in my apartment room. This process involved analyzing the dimensions of my floors, walls, and double pane windows and summarizing their thermal conduction through Fourier's Law. Based on this project, I was able to determine how well my apartment insulated heat (conclusion: It wasn't good. It's a poorly made studio apartment)
Heat Sink Design
This project involved designing a heat sink for a computer chip to keep the chip at a nominal temperature. Given materials and conditions such as chip surface area, thermal paste, contact pressure, and heatsink material were provided. The heatsink used a fin configuration, and the number of fins, fin length, thickness, and heat sink thickness was calculated to prevent the chip from overheating. The fin efficiency and thermal conductivity of the heat sink were also determined through the project.